Awarded

Supply

Ein Packaging-Tool für die Integration photonischer integrierter Schaltkreise

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Location: Canton VD
Procuring office: EPFL-Scientific Equipment
Requesting office: EPFL – Hybrid photonics laboratory (HYLAB)

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Awarded

According to the simap publication. Values that are not given are deliberately missing here.

Awarded to

As published on simap.ch: winner and price (with or without VAT, as stated).

Award of 02.03.20262 bids
- ficontec Service GmbH, AchimPrice not published

Awards of this contracting authority

The price is not published under public procurement law.

Justification

Das gewählte Material entspricht zum jetzigen und voraussehbaren Zeitpunkt am ehesten unseren finanziellen Mitteln und Bedürfnissen (Sicherung der Investitionen) unter Berücksichtigung der schnellen Entwicklung der Anforderungen in der Forschung.

AI summary

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Services
Requirements
Conditions
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Award criteria

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What is being procured?

Scope of work

Language of the publication

Die EPFL plant ein Packaging-Tool für die Integration photonischer integrierter Schaltkreise anzuschaffen. Als gemeinsame Plattform im CMi-Reinraum wird es verschiedenen Gruppen der EPFL zur Verfügung stehen.

Die Anlage dient der Spitzenforschung in den Bereichen Miniaturoptik, integrierte Photonik und MEMS.

Im Hinblick auf die Bedürfnisse der EPFL liegt der Schwerpunkt auf folgenden Punkten:

Ziel ist die vollständige Integration photonischer Bauelemente durch Verfahren wie Faser-Chip-Bonding, Faser-Array-Chip-Bonding, Butterfly-Packaging sowie Packaging von Laer und Freiraumoptiken unter Einsatz aktiver Ausrichtung und In-situ-Tests optischer und elektrooptischer Eigenschaften. Das vollautomatische System verfügt über ein aktives Ausrichtungssystem und basiert auf Löten und Kleben.

Photonisches Packaging muss folgende Funktionalitäten umfassen:

1. Duale aktive Ausrichtung

2. Montage mit UV-härtenden Epoxiden

3. Packaging von hybrid integrierten Lasern und photonischen Baugruppen

4. Chip-zu-Chip-Bonding (Kante und Oberseite)

5. Faser-zu-Chip-Bonding (Gitter und Kante)

6. Faser-Array-zu-Chip-Bonding (Gitter und Kante)

7. Freistrahloptik

8. Strahlprofilprüfung

9. Laserlöten

10. Elektrooptische Prüfung

11. Aktivierung verschiedener Chips auf dem Chuck

Key facts, codes and options

Type of contract: Supply
Type of supply: Purchase
Procedure: Open procedure
Trades: Not evident from the available publication data.
CPV: CPV 38000000 – Laboratory, optical and precision equipments (excl. glasses)
Options: Not evident from the available publication data.
Variants: Not evident from the available publication data.
Partial offers: Not evident from the available publication data.

TEXFY assessment: Products, installations, quantities, technical specifications and exclusions are not structured fields of the publication. TEXFY does not analyse the free text on them: check the original text and the tender documents.

Market data for this service

From awards published on simap.ch, without rankings and without rating companies.

Comparable awards

Laboratory and measuring equipment, canton of Vaud, last 12 months

39 awards, bids (median): 2.

Awards: Laboratory and measuring equipment

Range of award prices

Laboratory and measuring equipment, canton of Vaud, last 12 months

CHF 316’01510 % of the prices were lower

CHF 534’892Median: half were lower

CHF 2’060’00010 % of the prices were higher

8 out of 10 award prices were between CHF 316’015 and CHF 2’060’000.

From 17 published award prices in CHF from 02.12.2025 to 09.11.2026, with or without VAT, as published. A single contract can differ widely.

Official source

Go to the official tender

simap project number: 25203
Publication number: 25203-02
Covered by international agreements: Yes

Checked against simap: 10.11.2026, 18:02

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Contract awards in Vaud: monthly reports

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